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METHOD AND SYSTEM FOR ELECTROLESS PLATING THIN NICKEL FILM BY FLOWING PLATING SOLUTION ONTO SURFACE OF WORKPIECE
METHOD AND SYSTEM FOR ELECTROLESS PLATING THIN NICKEL FILM BY FLOWING PLATING SOLUTION ONTO SURFACE OF WORKPIECE
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机译:通过将电镀液流到工件表面上来化学镀镍薄膜的方法和系统
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摘要
PURPOSE: To provide thin film plating method and system capable of performing plating having a constant thickness without dipping of a work to be plated into a solvent when the work has a complicated structure to which electroplating or electroless plating is difficult to be applied although it has corrosion resistance and wear resistance, and to provide method and system capable of plating a narrow gap formed between parts. CONSTITUTION: The system(10) for electroless plating a thin nickel film comprises a plural tanks(15); driving units(16) capable of respectively extracting contents inside the tanks to the outside; a plating solution input/output part(14) comprising one or more plating solution input/output pipes connected to an end of valves to flow a plating solution, wherein the plating solution input/output pipes comprise a bladder mounted on an outer portion of the plating solution input/output pipes and inflatable when a fluid flows in the bladder, wherein the plating solution input/output pipes are easily inserted between a narrow gap of parts, and the gap is easily sealed by expansion of the bladder, and wherein the bladder is formed in a doughnut shape into the center of which a hole is penetrated, and a plural plating solution input/output pipes are mounted on the bladder.
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