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PMOS DEVICE WITH BF2 AND B11 ION-IMPLANTED REGION AND MANUFACTURING METHOD THEREOF

机译:具有BF2和B11离子注入区的PMOS器件及其制造方法

摘要

PURPOSE: A PMOS(P channel Metal Oxide Semiconductor) device and a manufacturing method thereof are provided to prevent the degradation of a short channel margin and to reduce contact resistance by forming locally a BF2 and B11 ion-implanted region in BF2 ion-implanted source/drain regions. CONSTITUTION: A gate electrode(14) is formed on a semiconductor substrate(10). An insulating spacer(16) is formed at both sidewalls of the gate electrode. BF2 ion-implanted source and drain regions(18) are formed in the substrate to align the gate electrode. A BF2 and B11 ion-implanted region(22) is locally formed in the source and drain regions, respectively. An insulating layer(20) with a source/drain contact hole(21) is formed thereon.
机译:目的:提供一种PMOS(P沟道金属氧化物半导体)器件及其制造方法,以通过在BF 2离子注入源中局部形成BF 2和B 11离子注入区来防止短沟道裕量的降低并减小接触电阻。 /排水区。组成:栅电极(14)形成在半导体衬底(10)上。在栅电极的两个侧壁处形成绝缘隔离物(16)。在衬底中形成离子注入BF 2的源极和漏极区(18),以对准栅电极。在源极和漏极区域中分别局部形成BF 2和B 11离子注入区域(22)。在其上形成具有源极/漏极接触孔(21)的绝缘层(20)。

著录项

  • 公开/公告号KR20040102417A

    专利类型

  • 公开/公告日2004-12-08

    原文格式PDF

  • 申请/专利权人 HYNIX SEMICONDUCTOR INC.;

    申请/专利号KR20030033787

  • 发明设计人 KIM YEONG HUN;

    申请日2003-05-27

  • 分类号H01L29/78;

  • 国家 KR

  • 入库时间 2022-08-21 22:06:29

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