METHOD OF MOUNTING ELECTRONIC COMPONENT BY ALLOY-BONDING BUMP AND LOW MELTING POINT METAL THROUGH PROCESS OF PRESSING BUMP AND HEATING LOW MELTING POINT METAL, STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MODULE, AND ELECTRONIC APPARATUS

摘要

PURPOSE: A method of mounting an electronic component, a structure for mounting an electronic component, an electronic component module, and an electronic apparatus are provided to achieve improved reliability of electrical connection between the electronic component and a substrate. CONSTITUTION: A substrate(60) includes a through hole(63) extended from connection electrodes(62,68) formed on a lower surface of the substrate, to an upper surface of the substrate; and a low melting point metal(64) connected to the connection electrodes and fills the through hole. A bump(44) and the low melting point metal are alloy-bonded by pressing the bump formed on an electrode pad(42) of an electronic component(40) with respect to a top of the low melting point metal, and heating the low melting point metal.