METHOD FOR PRODUCING SOLID STATE BONDED COMPOUND STRUCTURES BY DIFFUSION BONDING OF COMPOUND MATERIALS

摘要

PURPOSE: Provided is a method for producing compound(ceramic) structures excellent in bonding strength and electromagnetic property by diffusion bonding between interfaces without formation of the second phases. CONSTITUTION: The ceramic structures are produced by the following steps of: polishing the part/whole part of at least two ceramic pieces (10); forming a thin film(0.001-500micrometer of thickness) on the polished surface by inserting, depositing or coating process (20), wherein the thin film is composed of metals enabling incorporation or solid solution into the ceramic materials, or metal organics or metallic compounds, the metals are Li, Be, B, C, Na, Mg, Al, Si, K, Ca, Sc, Ti, V, etc., and the metallic compounds are metal boride, carbide, nitride, oxide, fluoride, silicide, etc.; thermal treating thin film-coated ceramic pieces, facing each other, for 1min-10hrs between melting and vaporizing temperature of the thin film under electric field(0-0.5KV), pressure of 0-100MPa, and atmosphere of air, vacuum, H2-contained gas or ceramic component-contained gas (30), which results in the formation of a directly bonded interface without the second phase; additional thermal treating under the same atmosphere as step (30).