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Reaction gas suppling apparatus for semiconductor processing and its clogging test methods to test an injection valve clogged up reaction gas

机译:用于半导体处理的反应气体供给装置及其堵塞测试方法,用于测试喷射阀堵塞的反应气体

摘要

A gas supplying apparatus of a system for fabricating semiconductor devices is tested for clogs. The gas supplying apparatus includes a carrier gas supplying device for supplying at least one carrier gas, and a plurality of reactive gas supplying devices connected in parallel to the carrier gas supplying device. The reactive gas supplying devices gasify the reactive gas carried by the carrier gas. A wafer, on which a desired layer is to be formed, is situated in a process chamber into which the reactive gas is supplied from the reactive gas supplying devices. The gas supplying apparatus also includes pressure detecing devices for detecting the pressure of the carrier gas near each of the reactive gas supplying devices. The carrier gas is supplied under a predetermined pressure to the reactive gas supplying devices. The reactive gas supplying device to be tested for clogs is rendered operational while the other reactive gas supplying devices are shut down. The pressure of the carrier gas near an outlet of the carrier gas supplying device is compared to the pressure of the carrier gas near an inlet of the reactive gas supplying device being tested to determine if the device is clogged.
机译:测试用于制造半导体器件的系统的气体供应装置的堵塞。气体供给装置包括:用于供给至少一种载气的载气供给装置;以及与该载气供给装置并联连接的多个反应性气体供给装置。反应气体供给装置将载气所携带的反应气体气化。将在其上形成期望层的晶片放置在处理室中,从反应气体供应装置向其中供应反应气体。气体供应设备还包括压力检测装置,该压力检测装置用于检测每个反应性气体供应装置附近的载气的压力。载气在预定压力下被供应到反应气体供应装置。在关闭其他反应性气体供应装置的同时,待测试的阻塞性反应性气体供应装置可操作。将载气供应装置的出口附近的载气的压力与被测试的反应性气体供应装置的入口附近的载气的压力进行比较,以确定该装置是否堵塞。

著录项

  • 公开/公告号KR100460140B1

    专利类型

  • 公开/公告日2004-12-03

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20010078578

  • 发明设计人 임민규;이승우;

    申请日2001-12-12

  • 分类号H01L21/00;

  • 国家 KR

  • 入库时间 2022-08-21 22:06:15

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