首页> 外国专利> APPARATUS OF MEASURING HORIZONTAL STATE OF WAFER CHUCK FOR RAPIDLY PERFORMING HORIZONTAL ADJUSTMENT PROCESS BY DETECTING HORIZONTAL STATE OF WAFER CHUCK WITHOUT MOVING WAFER CHUCK

APPARATUS OF MEASURING HORIZONTAL STATE OF WAFER CHUCK FOR RAPIDLY PERFORMING HORIZONTAL ADJUSTMENT PROCESS BY DETECTING HORIZONTAL STATE OF WAFER CHUCK WITHOUT MOVING WAFER CHUCK

机译:测量晶片卡盘的水平状态以通过不移动晶片卡盘来检测晶片卡盘的水平状态来快速执行水平调整过程的装置

摘要

PURPOSE: An apparatus of measuring a horizontal state of a wafer chuck is provided to perform rapidly a horizontal adjustment process by detecting the horizontal state of the wafer chuck without moving the wafer chuck. CONSTITUTION: A measuring unit(110) is in contact with a wafer chuck to measure a horizontal degree. The measuring unit is loaded on a loading unit(120). A supporting unit(130) supports the loading unit. The measuring unit includes a center gauge(112) to measure a horizontal state of a center part of the wafer chuck. The measuring unit further includes two edge gauges(114) to measure horizontal states of edge parts of the wafer chuck.
机译:目的:提供一种用于测量晶片卡盘的水平状态的设备,以通过检测晶片卡盘的水平状态而不移动晶片卡盘来快速地执行水平调节过程。组成:一个测量单元(110)与晶片卡盘接触以测量水平度。测量单元被装载在装载单元(120)上。支撑单元(130)支撑装载单元。测量单元包括中心量规(112),以测量晶片卡盘的中心部分的水平状态。测量单元还包括两个边缘量规(114),以测量晶片卡盘的边缘部分的水平状态。

著录项

  • 公开/公告号KR20050005887A

    专利类型

  • 公开/公告日2005-01-15

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20030045789

  • 发明设计人 KIM YOUNG JONG;

    申请日2003-07-07

  • 分类号H01L21/66;

  • 国家 KR

  • 入库时间 2022-08-21 22:06:00

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