ADHESIVE FILM COMPRISING THERMOSETTING RESIN COMPOSITION CONTAINING AT LEAST TWO CARBOXYL GROUPS-CONTAINING POLYVALENT CARBOXYLIC ACID OR ITS ANHYDRIDE AND EPOXY GROUP-CONTAINING ETHYLENE COPOLYMER, CURED LAMINATE OBTAINED BY USING THE ADHESIVE FILM, AND DEVICE OBTAINED BY USING THE ADHESIVE FILM

摘要

PURPOSE: Provided are an adhesive film which is excellent in processability, thermosetting property, adhesion and lead welding heat resistance, a cured laminate obtained by using the adhesive film, a device for a semiconductor device obtained by using the adhesive film, and a semiconductor device containing the device. CONSTITUTION: The adhesive film is prepared by forming a thermosetting resin composition comprising at least two carboxyl groups-containing polyvalent carboxylic acid or its anhydride and an epoxy group-containing ethylene copolymer into a film; and irradiating an electron beam onto the obtained film, wherein the epoxy group-containing ethylene copolymer is obtained by the addition polymerization of at least one of (b1) at least one of ethylene and propylene, and (b2) a monomer represented by the formula 1. In the formula 1, R is a C2-C18 hydrocarbon group having at least one double bond, and the hydrogen atom of the hydrocarbon group can be substituted with a halogen atom, a hydroxyl group or a carboxyl group; and X is a single bond or a carbonyl group.