首页> 外国专利> THIN FILM MANUFACTURING APPARATUS COMPRISING SYSTEM CAPABLE OF PERFORMING DOWNFLOW VENT WITHOUT STOPPING OF GAS IN DOWNFLOW STATE OF APPARATUS WHEN VENTING INSIDE OF APPARATUS AND METHOD FOR MANUFACTURING THIN FILM USING THE APPARATUS

THIN FILM MANUFACTURING APPARATUS COMPRISING SYSTEM CAPABLE OF PERFORMING DOWNFLOW VENT WITHOUT STOPPING OF GAS IN DOWNFLOW STATE OF APPARATUS WHEN VENTING INSIDE OF APPARATUS AND METHOD FOR MANUFACTURING THIN FILM USING THE APPARATUS

机译:薄型薄膜制造设备,其包括一种在设备内部通气时能够在没有气流停止的情况下在不停止气体的情况下执行下气孔的系统以及使用该设备制造薄型薄膜的方法

摘要

PURPOSE: To provide a thin film manufacturing apparatus and a thin film manufacturing method for improving productivity and mass-production of thin film by reproducing good film thickness distribution, composition distribution and film forming rate, reducing the number of particles and stably forming a continuous film over a long period of time. CONSTITUTION: In a thin film manufacturing apparatus that is a CVD(chemical vapor deposition) apparatus for forming a film by chemical reaction on a substrate heated by the substrate stage after introducing a film forming gas into the reaction chamber through the shower head from an upper part of a reaction chamber that is a reaction space of a vacuum controllable vacuum tank(1), the apparatus for manufacturing thin film is characterized in that the reaction space comprises a substrate stage(4), a shower head(3) and adhesion preventing plates(6), a gas exhaustion path is formed in an opening(8) between concentric circles comprising the adhesion preventing plates and the substrate stage, an inert gas flows along the adhesion preventing plates from the upper side of the gas exhaustion path, and a lower space is formed at a second side of the gas exhaustion path.
机译:目的:提供一种薄膜制造装置和薄膜制造方法,其通过再现良好的膜厚度分布,组成分布和成膜速率,减少颗粒数量并稳定地形成连续膜来提高薄膜的生产率和批量生产在很长一段时间内。组成:一种薄膜制造设备,该设备是一种CVD(化学气相沉积)设备,用于在通过上喷头将成膜气体通过喷淋头引入反应室之后,在通过衬底台加热的衬底上通过化学反应形成膜该反应室的一部分是真空可控真空罐(1)的反应空间,该薄膜制造装置的特征在于该反应空间包括基板台(4),喷淋头(3)和防止粘附板(6),在包括防粘板和基片台的同心圆之间的开口(8)中形成排气路径,惰性气体从防粘板从排气路径的上侧流过,并且在气体排出路径的第二侧形成有下部空间。

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