METHOD OF MANUFACTURING ARRAY TYPE LEAD FRAME PACKAGE AND LEAD FRAME WITH ENHANCED LAND ARRANGEMENT USED THEREFOR

摘要

PURPOSE: A method of manufacturing an array type lead frame package and a lead frame used for the same are provided to enhance the arrangement of lands by forming directly inner lands on a side of a frame pad. CONSTITUTION: A lead frame(40) includes a lead frame pad, a plurality of inner lands and a plurality of outer lands. The lead frame pad(41) has at least one or more sides. The plurality of inner lands(42b) are protruded from each side of the lead frame pad to the outside. The inner lands are spaced apart from each other. The inner lands are enclosed with the plurality of outer lands(42a). The outer lands are also spaced apart from each other.