METHOD FOR MANUFACTURING THE THIN COOPER FOIL ADHERED TO CARRIER AND, THIN COOPER FOIL ADHERED TO CARRIER, PRINTED CIRCUIT BOARD, MULTILAYER PRINTED CIRCUIT BOARD, AND CIRCUIT BOARD FOR CHIP ON FILM USING THE METHOD

摘要

An ultra-thin copper foil with carrier, a method for manufacturing the ultra-thin copper foil with carrier, a printed circuit board, a multilayer printed circuit board, and a circuit board for chip on film are provided to reduce the number of pin holes and good visibility by smoothing a surface of the carrier foil. At least one surface of a carrier copper foil is smoothed such that a mean surface roughness of the surface is 0.01 to 2.0mum. A chemical polishing, an electrochemical polishing, a smoothing plating processing process, and any combination of them are used for the smoothing process. A peeling layer and an ultra-thin copper foil are laminated sequentially on the surface of the smoothed carrier copper foil. Since mechanical strength of the copper foil with a thickness of less than 7mum is weak, the copper foil is not proper to play a role of a carrier foil. When the thickness of the carrier foil becomes more than 200mum, larger tension on manufacturing equipment is induced. Therefore the copper foil is preferably has the thickness between 7 and 200mum.