首页> 外国专利> COMPLEMENTARY DIVISION MASK HAVING ALIGNMENT MARK, METHOD FOR FORMING ALIGNMENT MARK OF THE COMPLEMENTARY DIVISION MASK, SEMICONDUCTOR DEVICE MANUFACTURED BY USING THE COMPLEMENTARY DIVISION MASK, AND ITS MANUFACTURING METHOD

COMPLEMENTARY DIVISION MASK HAVING ALIGNMENT MARK, METHOD FOR FORMING ALIGNMENT MARK OF THE COMPLEMENTARY DIVISION MASK, SEMICONDUCTOR DEVICE MANUFACTURED BY USING THE COMPLEMENTARY DIVISION MASK, AND ITS MANUFACTURING METHOD

机译:具有对准标记的补充分割掩模,形成补充分割掩模的对准标记的方法,使用补充分割掩模制造的半导体装置及其制造方法

摘要

Conventionally, a plurality of complementary division masks having an alignment mark are used to manufacture a semiconductor having patterns of layers, frequently causing misaligment of the layers. According to the invention, division alignment marks (M1a, M2a, M3a, M4a) are formed in complementary division areas corresponding to the respective complementary division masks (B1, B2, B3, B4) produced by dividing a stencil mask. By apportioning the alignment marks to the complementary division masks, the misalignments of the masks are averaged, thereby providing a semiconductor device free of much misalignment between the patterns of adjacent layers.
机译:传统上,具有对准标记的多个互补分割掩模被用于制造具有层图案的半导体,这经常引起层的误贴合。根据本发明,在与通过分割模板掩模而产生的各个互补分割掩模(B1,B2,B3,B4)相对应的互补分割区域中形成分割对准标记(M1a,M2a,M3a,M4a)。通过将对准标记分配给互补分割掩模,掩模的未对准被平均,从而提供了在相邻层的图案之间没有很多未对准的半导体器件。

著录项

  • 公开/公告号KR20050055695A

    专利类型

  • 公开/公告日2005-06-13

    原文格式PDF

  • 申请/专利权人 SONY CORPORATION;

    申请/专利号KR20057002019

  • 发明设计人 NOUDO SHINICHIRO;AMAI KEIKO;

    申请日2005-02-04

  • 分类号H01L21/027;

  • 国家 KR

  • 入库时间 2022-08-21 22:05:12

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