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COMPOUND OF EPOXY GROUT

机译:环氧树脂灌浆料

摘要

The present invention relates to the epoxy grout composition having excellent low temperature curing, and wet adhesion, and more particularly, an epoxy resin, a reactive diluent, a curing agent, a curing agent to the epoxy grout composition containing a silane compound, a curing catalyst and conventional additives amido an amine curing agent, by using a mixed aliphatic-modified polyamine hardener and pen alkaryl min curing agent, has improved workability and storage stability, can be cured at low temperatures, and to allow the viscosity is low, the structure maintenance of the micro-cracks parts, hardware and the structure represents a very useful properties for use in filling the connection portion, the present invention relates to improved epoxy grout composition that is excellent in adhesion to a wet surface of the.
机译:环氧灌浆组合物技术领域本发明涉及一种低温固化性和湿粘合性优异的环氧灌浆组合物,尤其涉及含有硅烷化合物的环氧灌浆组合物的环氧树脂,反应性稀释剂,固化剂,固化剂。催化剂和常规添加剂酰胺基胺胺固化剂,通过混合使用脂族改性多胺固化剂和链烷芳基胺固化剂,具有改善的加工性和储存稳定性,可以在低温下固化,并允许粘度低,结构维护微裂纹部件,硬件和结构代表了用于填充连接部分的非常有用的性能,本发明涉及改进的环氧灌浆组合物,其对湿润表面的粘附性优异。

著录项

  • 公开/公告号KR20050069491A

    专利类型

  • 公开/公告日2005-07-05

    原文格式PDF

  • 申请/专利权人 KCC CO. LTD.;

    申请/专利号KR20030101633

  • 申请日2003-12-31

  • 分类号C09J163/00;

  • 国家 KR

  • 入库时间 2022-08-21 22:04:56

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