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MATERIAL TRANSFER GRIPPER OF LOADING APPARATUS FOR BGA SEMICONDUCTOR PACKAGE TO SMOOTHLY TRANSFER MATERIAL AND PLAN TRANSFER PRECISION
MATERIAL TRANSFER GRIPPER OF LOADING APPARATUS FOR BGA SEMICONDUCTOR PACKAGE TO SMOOTHLY TRANSFER MATERIAL AND PLAN TRANSFER PRECISION
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机译:BGA半导体封装装填装置的材料转移夹具,用于平稳地转移材料和计划转移精度
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摘要
PURPOSE: A material transfer gripper of a loading apparatus for a BGA(ball grid array) semiconductor package is provided to smoothly transfer a material and plan transfer precision by including a transfer gripper having a gripper transferred in the right-and-left direction in a lead screw according to driving of a motor. CONSTITUTION: A material is transferred by a pair of guide rails A of a predetermined length installed under an inspection part(V) of an inspection system. A lead screw(13) is rotated by the driving of a motor(11), installed under the right center of the guide rail A in parallel with the length direction of the guide rail A. The upper end of a gripper is positioned in the right center of the guide rail A while the gripper is coupled to the lead screw. A guide to which a part of the gripper is coupled stably guides the gripper in the right-and-left direction, installed in the outside of the guide rail A in parallel with the guide rail A.
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