electroplating bath for copper-nickel alloy and method for manufacturing thin film using said electroplating bath

摘要

The copper-nickel alloy thin film plating solution and the thin film manufacturing method using the solution comprises a DTPA as a mixed solution with a complexing agent of dongyeom (CuSO ₄ H ₂ O) and nickel salts (NiSO ₄ 6H ₂ 0), the dongyeom is 24.7 ~ 49.9 g / L, the nickel salt has a range of 209.6 ~ 235.8 g / L, the amount of DTPA is added 39.3 ~ 78.6 g / L range. Further, copper-nickel alloy plating solution further comprises the use of sodium to alkaline as an additive for the uniformity of the surface layer to improve the smoothness and gloss of sodium heptane tonsan, plated surface.; As another embodiment of the invention, the copper-current density of the composition to have a 60 to 80 wt% of nickel using a nickel alloy plating solution is 30 ~ 50 A / cm ^2, the value of pH is 6.0, the range of ± 0.5 copper formed in - the method of producing a nickel alloy thin film is provided.