首页> 外国专利> Method for fabricating pMOSFET having Ultra Shallow Super-Steep-Retrograde epi-channel formed by Multiple channel doping

Method for fabricating pMOSFET having Ultra Shallow Super-Steep-Retrograde epi-channel formed by Multiple channel doping

机译:通过多沟道掺杂形成具有超浅超陡峭逆向epi沟道的pMOSFET的制造方法

摘要

The present invention provides a p-channel metal-oxide-semiconductor (pMOS) device having an ultra shallow epi-channel satisfying a high doping concentration required for a device of which gate length is about 30 nm even without using a HALO doping layer and a method for fabricating the same. The pMOS device includes: a semiconductor substrate; a channel doping layer being formed in a surface of the semiconductor substrate and being dually doped with dopants having different diffusion rates; a silicon epi-layer being formed on the channel doping layer, whereby constructing an epi-channel along with the channel doping layer; a gate insulating layer formed on the silicon epi-layer; a gate electrode formed on the gate insulating layer; a source/drain extension region highly concentrated and formed in the semiconductor substrate of lateral sides of the epi-channel; and a source/drain region electrically connected to the source/drain extension region and deeper than the source/drain region.
机译:本发明提供了一种p沟道金属氧化物半导体(pMOS)器件,其具有超浅的外延沟道,即使不使用HALO掺杂层,该栅沟道长度也满足栅极长度约为30nm的器件所需的高掺杂浓度。的制造方法。该pMOS器件包括:半导体衬底;以及沟道掺杂层形成在半导体衬底的表面中并且被双重掺杂具有不同扩散速率的掺杂剂;在沟道掺杂层上形成硅外延层,从而与沟道掺杂层一起构成外延沟道。形成在硅外延层上的栅极绝缘层;在栅绝缘层上形成的栅电极;源/漏扩展区高度集中并形成在epi沟道的侧面的半导体衬底中;源/漏区电连接到源/漏扩展区并且比源/漏区深。

著录项

  • 公开/公告号KR100486609B1

    专利类型

  • 公开/公告日2005-05-03

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20020086275

  • 发明设计人 손용선;

    申请日2002-12-30

  • 分类号H01L29/78;

  • 国家 KR

  • 入库时间 2022-08-21 22:03:53

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