首页> 外国专利> TFT with souece/drain electrode of double layer and Method for Fabricating the Same and Active Matrix display device and Method for fabricating the Same using the TFT

TFT with souece/drain electrode of double layer and Method for Fabricating the Same and Active Matrix display device and Method for fabricating the Same using the TFT

机译:具有双层源/漏电极的TFT及其制造方法和有源矩阵显示装置以及使用该方法制造TFT的方法

摘要

The present invention discloses a method of manufacturing an active matrix display device, comprising: a) forming a semiconductor layer on an insulating substrate; b) forming a gate insulating layer over the whole surface of the substrate while convering the semiconductor layer; c) forming a gate electrode on the gate insulating layer over the semiconductor layer; d) forming spacers on both side wall portions of the gate electrode while exposing both end portions of the semiconductor layer; e) ion-implaing a high-density impurity into the semiconductor layer to form high-density source and drain regions in the semiconductor layer; f) depositing sequentially a transparent conductive layer and a metal layer on the inter insulating layer; g) patterning the transparent conductive layer and the metal layer to form the source and drain electrodes, the source and drain electrodes directly contacting the high-density source and drain regions and having a dual-layered structure; h) forming a passivation layer over the whole surface of the substrate; i) etching the passivation layer and the metal layer to form an opening portion exposing a portions of the transparent conductive layer, thereby forming a pixel electrode; and j) performing a reflow process to cover the metal layer in the opening portion by the passivation layer.
机译:本发明公开了一种有源矩阵显示装置的制造方法,包括:a)在绝缘基板上形成半导体层; b)在会聚半导体层的同时,在衬底的整个表面上形成栅绝缘层; c)在半导体层上方的栅绝缘层上形成栅电极; d)在栅电极的两个侧壁部分上形成隔离物,同时暴露半导体层的两个端部; e)将高密度杂质离子注入到半导体层中,以在半导体层中形成高密度源极和漏极区; f)在中间绝缘层上顺序沉积透明导电层和金属层; g)对透明导电层和金属层进行构图以形成源极和漏极,该源极和漏极直接接触高密度源极和漏极区域并具有双层结构; h)在衬底的整个表面上形成钝化层; i)蚀刻钝化层和金属层以形成暴露部分透明导电层的开口部分,从而形成像素电极; j)进行回流处理以通过钝化层覆盖开口部分中的金属层。

著录项

  • 公开/公告号KR100496420B1

    专利类型

  • 公开/公告日2005-06-17

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20010010840

  • 发明设计人 소우영;유경진;박상일;

    申请日2001-03-02

  • 分类号G02F1/136;

  • 国家 KR

  • 入库时间 2022-08-21 22:03:45

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