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Method of fabricating a chemical mechanical polishing pad conditioner using ceramic material and chemical mechanical polishing pad conditioner fabricated thereby

机译:使用陶瓷材料制造化学机械抛光垫修整器的方法和由此制造的化学机械抛光垫修整器

摘要

PURPOSE: A method for fabricating a CMP pad conditioner using a ceramic material and a CMP pad conditioner fabricated thereby are provided to enhance tolerance to acid slurries and alkali slurries by using a ceramic layer having acid-resistant property and alkali property. CONSTITUTION: Polishing particles are arranged on a metal substrate(101). A sacrificial metal layer is selectively formed on the metal substrate between the polishing particles(103). The metal substrate is removed therefrom. A ceramic layer is formed to cover the polishing particles and the sacrificial metal layer and hold the polishing particles(105,107). The polishing particles are projected by removing the sacrificial metal layer(109). The ceramic layer is bonded to a metal shank(111).
机译:用途:提供一种使用陶瓷材料制造CMP垫修整剂的方法和由此制造的CMP垫修整剂,以通过使用具有耐酸特性和碱特性的陶瓷层来增强对酸浆和碱浆的耐受性。组成:抛光颗粒排列在金属基板上(101)。在抛光颗粒(103)之间的金属基板上选择性地形成牺牲金属层。从其中去除金属基板。形成陶瓷层以覆盖抛光颗粒和牺牲金属层并保持抛光颗粒(105,107)。通过去除牺牲金属层(109)来投射抛光颗粒。陶瓷层结合到金属柄(111)上。

著录项

  • 公开/公告号KR100508300B1

    专利类型

  • 公开/公告日2005-08-17

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20030028467

  • 发明设计人 정만섭;

    申请日2003-05-06

  • 分类号H01L21/304;

  • 国家 KR

  • 入库时间 2022-08-21 22:03:33

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