Flexible Copper Clad Laminates and Flexible Copper Sputtering Clad Laminates and Methode of Producting Multi-Layer Printed Circuit Board for Fine Pattern.

摘要

Basic present design is comprised of a flexible copper clad laminate (FCCL), and a flexible copper-sputtering plate and relates to a fine pattern manufactured multi-layer printed circuit board for utilizing them, more particularly resin infiltration process residence or polyimide, and a resin infiltration process residence Prepreg) film 20 and the base film 20, the seed metal sputtering film 30 is sputtered on, and characterized in that the configuration including the copper sputtering film 40 is sputtered onto the seed metal sputtering film 30 using the flexible copper-sputtering plate 70 or a flexible copper-clad laminate 60, the flexible copper-clad laminate 60, characterized in that comprises a copper plating film 50 plated over the copper sputtering film 40 It relates to a multi-layer printed circuit board produced by.; If it depends on the subject innovation, the conventional multi-layer printed circuit board to manufacture a multilayer printed circuit board capable of forming a fine pattern of several tens or several microns pitch did not approach so far is capable of, miniaturization of the next machine, multi-function there is the advantage that it can respond very effectively.