System for manufacturing molded interconnect device (MID) with at least one conductive path, with MID containing substrate surface of thermally softening, electrically insulating material for conductive path location

摘要

Manufacturing system for MID with at least one conductive path, consisting of thermally softening, electrically insulating substrate surface for locating conductive path, whose material is separately stored with respect to substrate surface. Substrate surface is softened by thermal energy application in locally limited region and conductive material is applied to softened material of substrate surface. Both thermal softening and conductive path application are carried out along preset trajectory. Independent claims are included for manufacturing appliance for MID.