Component used in microelectronics, especially as a flip-chip contact comprises a solder connection formed between a first partial body having a first flat metallization and a second partial body having a second flat metallization

摘要

Component comprises a solder connection formed between a first partial body (TK1) having a first flat metallization and a second partial body (TK2) having a second flat metallization. The solder connection comprises a solder body made from a fusible solder. One of the metallizations has a nanocrystalline layer on the surface facing the solder body. An independent claim is also included for a process for the production of a solder connection on a component.