Method of forming a resistive layer on a substrate for integrated circuits deposits a polycrystalline crystallite layer makes partly amorphous and anneals to give a different crystallite size

摘要

A method of forming a resistive layer on a substrate (10) comprises bringing a polycrystalline layer onto the substrate having crystallites of a given mean size, at least partly amorphizing this, and annealing (14) to give a different mean crystallite size to produce the resistive layer.