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Current processor unit has housing containing conductor and signal areas with chip running temperature compensation program connected through bond wires to current and signal pins
Current processor unit has housing containing conductor and signal areas with chip running temperature compensation program connected through bond wires to current and signal pins
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机译:当前处理器单元的外壳包含导体和信号区域,芯片运行温度补偿程序通过键合线连接到电流和信号引脚
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摘要
A current processor unit has a housing containing a conductor frame with current conductor area (100) and chip area (102) with the chip (110) connected by bond wires (120, 122, 150-154) to the conductor (140, 142) and signal (146, 148) pins and running a temperature compensation program : Independent claims are included for the procedures used to manufacture the current processor using a conductor frame mounted chip.
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