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Integrated microsystem manufacturing method e.g. for resonator, acceleration sensor or rotation rate sensor, has substrate provided with first function layer and structured mechanical function layer in succession
Integrated microsystem manufacturing method e.g. for resonator, acceleration sensor or rotation rate sensor, has substrate provided with first function layer and structured mechanical function layer in succession
The manufacturing method has a first function layer (3) incorporating a conductive region (7) and a mechanical function layer (4) applied in succession to the surface of a substrate (2). A cover layer (8) applied to the conductive region of the first function layer is provided with an etching stop layer (11), acting as a protection layer during etching of an upper layer applied over the first function layer and acting as an etching stop after removal of the upper layer.
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