Producing a multiple layer arrangement with a metal layer comprises applying a metal layer on one surface of a first wafer, applying an intermediate layer on the metal layer, and further processing

摘要

Producing a multiple layer arrangement with a metal layer comprising applying a metal layer on one surface of a first wafer, applying an intermediate layer on the metal layer, applying a second wafer on the intermediate layer, and removing the first wafer so that the metal layer is exposed, is new.