Method for fixing element-group on carrier layer e.g. for miniaturization of communication devices, involves joining first and second elements together at an initial temperature, so that a mutual mechanical force is exerted

摘要

A method for fixing an element-group (EG) having a first element (SD) with a first thermal coefficient of expansion and a second element (SR) with a second thermal expansion coefficient, smaller than the first, on a carrier/support layer (TS), involves arranging the second element on the carrier layer, joining the first element to the second element at an initial temperature (Ti) with the connection section of the first and second element designed so that a mechanical force is mutually exerted, followed by heating up the element group to a first temperature followed by further heating of the arrangement of the element group and the carrier layer to a second temperature at which the solder melts. The arrangement is then cooled to a third temperature so that the solder hardens, and further cooling then takes place to a fourth temperature at which the connection sections of the two elements (SD,SR) provide a mutual mechanical force on each of the elements. Independent claims are included for (a) an element group, for (b) a carrier arrangement and for (c) a carrier/support layer.