Mounting method for semiconductor chip, involves deflecting gripper relative to bonding head so as to lower chip at soldering portion of substrate and then raising it by preset distance before being let go by gripper

摘要

The semiconductor chip (1) is held by the elastic gripper (5) attached to the bonding head (4). The chip is raised over the soldering portion (2) of the substrate (3) to specific position. The chip is lowered over the solder portion, by deflecting gripper relative to head so as to mount chip on soldering portion, and the chip is then raised by a preset height before being let go by gripper. The lowering and raising height of bonding head relative to the bearing seat (9) of the substrate is measured by a sensor. Based on the measured height value, deflection height of bonding head is determined. The chip is moved vertically and repeatedly based on the deflection amount. An independent claim is also included for semiconductor chip mounting device.