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Electronic device manufacturing method has electronic component enclosed by plastics housing with applied metallized layer for providing electromagnetic screening
Electronic device manufacturing method has electronic component enclosed by plastics housing with applied metallized layer for providing electromagnetic screening
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机译:电子设备的制造方法是将电子部件用塑料外壳包围,并在其上涂上金属化层以提供电磁屏蔽
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摘要
The manufacturing method has at least one electronic component (2) enclosed by a housing having a plastics component and a metal component, providing electromagnetic screening of the electronic component. The housing is formed in a 2-stage process in which the electronic component is initially enclosed by a plastics mass (3), which is then provided with a metallized layer (4). An independent claim for an electronic device is also included.
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