首页> 外国专利> Electronic device manufacturing method has electronic component enclosed by plastics housing with applied metallized layer for providing electromagnetic screening

Electronic device manufacturing method has electronic component enclosed by plastics housing with applied metallized layer for providing electromagnetic screening

机译:电子设备的制造方法是将电子部件用塑料外壳包围,并在其上涂上金属化层以提供电磁屏蔽

摘要

The manufacturing method has at least one electronic component (2) enclosed by a housing having a plastics component and a metal component, providing electromagnetic screening of the electronic component. The housing is formed in a 2-stage process in which the electronic component is initially enclosed by a plastics mass (3), which is then provided with a metallized layer (4). An independent claim for an electronic device is also included.
机译:该制造方法具有至少一个电子部件(2),该电子部件(2)被具有塑料部件和金属部件的壳体包围,从而对电子部件进行电磁屏蔽。壳体以两阶段工艺形成,其中电子组件首先被塑料块(3)包围,然后再提供金属化层(4)。还包括对电子设备的独立权利要求。

著录项

  • 公开/公告号DE10345302A1

    专利类型

  • 公开/公告日2005-04-21

    原文格式PDF

  • 申请/专利权人 HELLA KGAA HUECK & CO.;

    申请/专利号DE2003145302

  • 发明设计人 SCHROEDER DIRK;KALWA MATTHIAS;

    申请日2003-09-30

  • 分类号H05K9/00;H01L23/58;H01L23/06;

  • 国家 DE

  • 入库时间 2022-08-21 22:01:11

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