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Process for removing organic components from electronic scrap comprises subjecting ground electronic scrap containing metallic, inorganic and organic mixtures in water to an oxidizing atmosphere of air or oxygen-nitrogen mixtures
Process for removing organic components from electronic scrap comprises subjecting ground electronic scrap containing metallic, inorganic and organic mixtures in water to an oxidizing atmosphere of air or oxygen-nitrogen mixtures
Process for removing organic components from electronic scrap comprises subjecting ground electronic scrap containing metallic, inorganic and organic mixtures having a grain size of 0.001-10 mm in water to an oxidizing atmosphere of air or oxygen-nitrogen mixtures at a pressure of 22-120 bar and a temperature of 100-375[deg] C for 0.02-4 hours.
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