首页> 外国专利> Component gluing method for circuit board, involves selecting distance between circuit component edge and adhesive lines, and quantity of adhesive, for applying adhesive along lines for placing circuit components on circuit board

Component gluing method for circuit board, involves selecting distance between circuit component edge and adhesive lines, and quantity of adhesive, for applying adhesive along lines for placing circuit components on circuit board

机译:电路板的组件粘合方法,包括选择电路组件边缘和粘合线之间的距离以及粘合剂的数量,以便沿着线施加粘合剂以将电路组件放置在电路板上

摘要

The distance between the edges (52,53,59,60) of circuit components (51,54,55,61,73) and adhesive lines (56,57,58,62,63) parallel to edge, and quantity of adhesive to be applied along the line, are selected based on which adhesive is applied along the adhesive lines, after which circuit components are placed on the circuit board. An independent claim is also included for device for applying adhesive on circuit board.
机译:电路组件(51,54,55,61,73)的边缘(52,53,59,60)与平行于边缘的粘合线(56,57,58,62,63)之间的距离以及粘合剂的数量沿线选择要涂覆的粘合剂,基于沿粘合剂线涂覆的粘合剂,然后将电路元件放置在电路板上。还包括用于在电路板上施加粘合剂的装置的独立权利要求。

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