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Component gluing method for circuit board, involves selecting distance between circuit component edge and adhesive lines, and quantity of adhesive, for applying adhesive along lines for placing circuit components on circuit board
Component gluing method for circuit board, involves selecting distance between circuit component edge and adhesive lines, and quantity of adhesive, for applying adhesive along lines for placing circuit components on circuit board
The distance between the edges (52,53,59,60) of circuit components (51,54,55,61,73) and adhesive lines (56,57,58,62,63) parallel to edge, and quantity of adhesive to be applied along the line, are selected based on which adhesive is applied along the adhesive lines, after which circuit components are placed on the circuit board. An independent claim is also included for device for applying adhesive on circuit board.
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