Embossing process for preparation of a microcapacity ultrasonic transducer by provision of a substrate having electrical conductivity useful in applications involving the piezoelectric effect

摘要

Embossing process for preparation of a microcapacity ultrasonic transducer by provision of a substrate having electrical conductivity, formation of a carrier film on it, of recesses in the carrier layer by embossing, of a polymer film, deposition of upper electrodes on the polymer film, and adhesive sealing of the polymer film rear side to the carrier film to seal the recesses, giving hollow spaces corresponding to the electrodes, and producing a number of ultrasonic transducers.