首页> 外国专利> Determining depth of recesses formed in supporting substrate involves recording and evaluating time profile of reduction in weight of substrate during evaporation of moistening substance

Determining depth of recesses formed in supporting substrate involves recording and evaluating time profile of reduction in weight of substrate during evaporation of moistening substance

机译:确定在支撑基板中形成的凹槽的深度涉及记录和评估在润湿物质蒸发期间基板重量减少的时间曲线

摘要

The method involves applying an essentially uniform layer of moistening substance (3) to an area of the substrate (1) surface with recesses (2), recording a time profile of the reduction in weight of the substrate during evaporation of the substance, evaluating the time profile to determine a characteristic weight value when the substance has evaporated from the surface but the recesses are still filled with it and determining the depth (R) of the recesses taking into account the specific weight of the substrate without the substance, the density of the substance and the total area occupied by the recesses.
机译:该方法包括将基本上均匀的润湿物质层(3)施加到具有凹槽(2)的基材(1)表面区域,记录在物质蒸发过程中基材重量减少的时间曲线,评估时间分布图,以确定当物质已从表面蒸发但凹口仍然充满时的特征重量值,并考虑到没有物质的基材的比重,密度和密度来确定凹口的深度(R)凹槽的实质和总面积。

著录项

  • 公开/公告号DE102004007952B3

    专利类型

  • 公开/公告日2005-09-01

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE20041007952

  • 发明设计人 TEMMLER DIETMAR;WEIDNER PETER;

    申请日2004-02-18

  • 分类号H01L21/66;

  • 国家 DE

  • 入库时间 2022-08-21 22:00:52

相似文献

  • 专利
  • 外文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号