Saw system for slicing hard brittle material especially crystal has a set of parallel saw blades each backed by a polishing blade in a common holder

摘要

A saw system for slicing hand brittle material, e.g. crystal, has a number of parallel saw blades held in a frame as well as a similar number of polishing blades, each set behind a saw blade and held in the same frame. This enables the system to slide and polish in one operation. The saw blades have an abrasive coating on the cutting edge and on each side of the cutting edge with a typical grit size of 20 to 100 microns. The polishing blades have an abrasive coating on the leading edge and totally covering both sides and with a finer grit size of 20 to 50 microns. The saw holder and/or the workpiece mounting are driven reciprocally to generate the saw action.