Contacting card for use in testing integrated circuits, has a substrate carrier with contacts matching those of a wafer substrate to be tested and connects from these contacts to a testing device

摘要

Contact card (1) for connection of a test arrangement for testing integrated circuits on a wafer-type substrate (6) has a substrate carrier (2), which is essentially the same size as the substrate disk. On the first surface (3) of the substrate carrier are projecting contact points (4) that are arranged so that they mirror the positions of contact surfaces (5) on the substrate to be tested. In or on the substrate carrier are contact strips (9) to connect the contact points to contacts (7) on its opposing surface (8). The invention also relates to a corresponding method and device for testing integrated circuits on a substrate.