首页> 外国专利> Flexible flat conductor and printed circuit board connecting method, involves heating applied brazing deposit through opening, present in or against electro-conducting zone, traversing conductor for soldering conductor to board

Flexible flat conductor and printed circuit board connecting method, involves heating applied brazing deposit through opening, present in or against electro-conducting zone, traversing conductor for soldering conductor to board

机译:柔性扁平导体和印刷电路板的连接方法,涉及通过存在于导电区中或紧靠导电区的开口加热施加的钎焊沉积物,横越导体以将导体焊接到板上

摘要

The method involves applying a brazing deposit (3) to an electro-conducting contact zone (11) of a printed circuit board (1). An electro-conducting contact zone (21) is presented on a side of a flat conductor (2) pointed towards the board and is set in contact with the deposit. The deposit is heated through an opening (23), present in or against the zone (21), traversing the conductor so that the conductor is soldered with the board. Independent claims are also included for the following: (a) a flexible flat conductor (b) a group of electronic components with printed circuit board and flat conductor.
机译:该方法包括将钎焊沉积物(3)施加到印刷电路板(1)的导电接触区(11)上。在指向板的扁平导体(2)的一侧设有导电接触区(21),该导电接触区设置成与沉积物接触。沉积物通过存在于区域(21)中或靠着区域(21)的开口(23)加热,横穿导体,从而使导体与板焊接在一起。还包括以下方面的独立权利要求:(a)柔性扁平导体(b)一组带有印刷电路板和扁平导体的电子组件。

著录项

  • 公开/公告号DE102004038401A1

    专利类型

  • 公开/公告日2005-05-19

    原文格式PDF

  • 申请/专利权人 CONTI TEMIC MICROELECTRONIC GMBH;

    申请/专利号DE20041038401

  • 发明设计人 HEINZ HELMUT;KOENIG SIBYLL;

    申请日2004-08-07

  • 分类号H01R43/02;H01R12/10;H05K3/34;

  • 国家 DE

  • 入库时间 2022-08-21 22:00:43

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