Soldering with reaction solder, e.g. for use when mounting electronic components, involves separately melting two or more different solder materials and mixing them so that new alloy is formed directly at solder point

摘要

The method involves separately melting two or more different solder materials (1a,1b) and mixing them so that a new alloy is formed directly at the soldering point (6). Two or more different solder materials are separately fed to a mixing chamber (3) where they are melted and mixed and fed via an opening to the soldering point so that a new alloy is formed. An independent claim is also included for a soldering device.