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Wire stitching device for bundling of perforated under layers stacking

机译:用于打孔下层堆叠的捆扎装置

摘要

Stapling device (4; 4 ''; 4 "; 4(3)) for bundling of perforated under layers stacks (1), in particular by the din a4 - format, comprising at least one of two tongues that (6) having a base plate (5) and a cover plate (7; 7(3)) with recesses (11) for the insertion of the tongues that (6), characterized in that the cover plate (7; 7(3)), in particular in the region of the fit-through recesses (11), and / or the tongues that (6) itself are fashioned in such a way that the tongues that (6) is inserted as close as possible along the edge (12) a throughpass opening (11), so that, by means of the recesses (11) in the cover plate (7; 7(3)) in addition to the respective gripping tongue (6) in each case a bracket (14) of a binder is to be plugged in.
机译:装订设备(4; 4''; 4“; 4 (3)),用于装订穿孔的下层纸叠(1),特别是通过din a4-格式捆扎,包括至少两个舌片(6)具有底板(5)和盖板(7; 7 (3)),带有用于插入舌片(6)的凹槽(11),其特征在于盖板(7; 7 (3)),特别是在穿通凹槽(11)的区域和/或舌片(6)本身以这种方式制成使舌片(6)尽可能沿着边缘(12)插入通孔(11),以便借助盖板(7; 7 (3)中的凹槽(11) ))和相应的抓舌(6)分别插入活页夹支架(14)。

著录项

  • 公开/公告号DE202004001475U1

    专利类型

  • 公开/公告日2005-06-16

    原文格式PDF

  • 申请/专利权人 RIEDRICH GERT HANS;

    申请/专利号DE20042001475U

  • 发明设计人

    申请日2004-01-30

  • 分类号B42F13/06;

  • 国家 DE

  • 入库时间 2022-08-21 22:00:37

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