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Wire stitching device for bundling of perforated under layers stacking
Wire stitching device for bundling of perforated under layers stacking
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机译:用于打孔下层堆叠的捆扎装置
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摘要
Stapling device (4; 4 ''; 4 "; 4(3)) for bundling of perforated under layers stacks (1), in particular by the din a4 - format, comprising at least one of two tongues that (6) having a base plate (5) and a cover plate (7; 7(3)) with recesses (11) for the insertion of the tongues that (6), characterized in that the cover plate (7; 7(3)), in particular in the region of the fit-through recesses (11), and / or the tongues that (6) itself are fashioned in such a way that the tongues that (6) is inserted as close as possible along the edge (12) a throughpass opening (11), so that, by means of the recesses (11) in the cover plate (7; 7(3)) in addition to the respective gripping tongue (6) in each case a bracket (14) of a binder is to be plugged in.
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