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Heat conducting paste for joining electronic components in a computer chip contains a filler based on graphite powder and a matrix material based on oil, grease or wax
Heat conducting paste for joining electronic components in a computer chip contains a filler based on graphite powder and a matrix material based on oil, grease or wax
Heat conducting paste contains 10-80 wt.% filler based on graphite powder and 20-90 wt.% matrix material based on oil, grease or wax. An independent claim is also included for a matrix material used in the above paste.
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