3 D pressure sensor has encapsulated sensor chip facing hole and ASIC processing circuit mounted above it under cap

摘要

A 3D pressure sensor has an encapsulated (9) sensor chip (3) and signal processing ASIC (Application Specific Integrated Circuit) (7) placed on one side of a circuit carrier (1) so that the ASIC circuit is on a functional element (6) above the sensor and the sensor has its rear side bonded to the pressure application area facing a hole (2) in the circuit board.