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Composite support to receive a transferred layer for epitaxy of working layers for electronics, optical and opto-electronic applications

机译:复合支撑,用于接收用于电子,光学和光电应用的工作层外延的转移层

摘要

A composite support (10) destined to receive a transferred layer (20) of crystalline material, to form a substrate for epitaxy, has a symmetrical longitudinal plane parallel to its principle surfaces and is made up of: (A) a first central layer (1) having a first coefficient of thermal dilation at a determined temperature (T) and extending transversely either side of the plane of symmetry; (B) at least one pair of lateral layers (2, 2'), each pair having dispositions in the composite support essentially symmetrical with respect to the plane of symmetry, with second coefficients of thermal dilation at the temperature (T) identical to each other and with essentially identical thickness; and (C) the materials constituting the layers of the composite support are chosen such that the composite support has a global coefficient of thermal dilation at temperature (T) close to that of the material of the transferred layer. Independent claims are also included for: (A) the formation of a layer on a composite support; (B) the formation of a number of substrates for epitaxy using this method of forming a layer on a composite support; and (C) a structure made up of the substrate for epitaxy.
机译:用于容纳晶体材料的转移层(20)以形成外延衬底的复合支撑(10),该支撑具有平行于其主表面的对称纵向平面,并由以下部分组成:(A)第一中央层( 1)在确定的温度(T)下具有第一热膨胀系数,并在对称平面的任一侧横向延伸; (B)至少一对侧向层(2、2'),每对侧向层在复合支撑中具有相对于对称平面基本对称的布置,并且在温度(T)下的第二热膨胀系数与每个其他且厚度基本相同; (C)选择构成复合载体层的材料,以使复合载体在温度(T)下具有接近转移层材料的整体热膨胀系数。还包括以下方面的独立权利要求:(A)在复合载体上形成层; (B)使用这种在复合载体上形成层的方法形成许多用于外延的衬底; (C)由外延用基板构成的结构。

著录项

  • 公开/公告号FR2864970A1

    专利类型

  • 公开/公告日2005-07-15

    原文格式PDF

  • 申请/专利权人 SOITEC;

    申请/专利号FR20040000175

  • 发明设计人 LEVAILLANT YVES MATHIEU;

    申请日2004-01-09

  • 分类号C30B25/18;H01L21/20;

  • 国家 FR

  • 入库时间 2022-08-21 21:58:16

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