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Integrated circuit with an adhesive liaison offering high protection against unwanted analysis, for use in security applications for secret or confidential information storage

机译:带有粘合剂联络的集成电路可提供高度保护,防止不必要的分析,可用于安全应用中的秘密或机密信息存储

摘要

Integrated circuit in which some surfaces of the side supports face to face with a layer, fitted with the structures of the circuit, of a substrate and a support (1) are linked with the aid of a glue layer. The adhesive liaison consists of adhesive materials which form at least two adhesive threads (3,4). The first adhesive thread (3) is formed in the zone of the junction that one may reach at the exterior and that is found between the layer and the support and the second adhesive thread (4) extends parallel to this in the inner zone of the facing support surfaces.
机译:集成电路,其中侧面支撑物的一些表面面对面地具有一层与电路的结构相适应的基底和支撑物(1),借助胶层连接。粘合剂联络处由形成至少两个粘合剂线(3,4)的粘合剂材料组成。第一粘合线(3)形成在接合部的区域中,该区域可以在外部到达并且位于层与支撑之间,并且第二粘合线(4)在接合部的内部区域中平行于此延伸。面向支撑表面。

著录项

  • 公开/公告号FR2865561A1

    专利类型

  • 公开/公告日2005-07-29

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号FR20050000750

  • 发明设计人 JANKE MARCUS;LAACKMANN PETER;

    申请日2005-01-25

  • 分类号G06K19/077;H01L21/58;

  • 国家 FR

  • 入库时间 2022-08-21 21:58:16

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