COEXTRUSION FILM HAVING PINHOLE RESISTANCE AND BARRIER LAMINATED OUTER BAG USING IT

摘要

PROBLEM TO BE SOLVED: To provide a thermal fusion film used in a gas barrier laminated outer bag and having pinhole resistance suppressing the occurrence of a pinhole during a transport process, and the gas barrier laminated outer bag.;SOLUTION: The thermal fusion film for use in the gas barrier laminated outer bag comprises a three-layered laminated film of A/B/C from the contact side with content when the total thickness thereof is below 70 μm. Further, when the total thickness thereof is not below 70 μm, the thermal fusion film comprises a two-layered laminated film (A/B) or the three-layered laminated film (A/B/C). The thickness of the respective layers are set to A≤C≤B and the densities of the respective layers are set to AC≥B.;COPYRIGHT: (C)2006,JPO&NCIPI