LASER PROCESSING METHOD FOR WIRING CONNECTION BY ULTRAVIOLET BEAM LASER AND ITS PROCESSING EQUIPMENT

摘要

PPROBLEM TO BE SOLVED: To provide a laser processing method which carries out an accurate and fine wiring connection processing by a non-thermal processing method using ultraviolet laser light of a wave length shorter than 400m for an accurate wiring connection of a semiconductor integrated circuit device. PSOLUTION: When performing the wiring connection, the ultraviolet laser light L of a wave length shorter than 400m is collected onto an upper surface, a diagonal side, or a nearness of metal wiring of a portion to be processed which is a wiring connection portion of an obstacle to be processed, from a laser processing equipment 6 which is composed of an ultraviolet laser oscillator 1, a beam expander 2 to enlarge the diameter of beam of the ultraviolet laser light L, an attenuator 3 to adjust an amount of energy of the ultraviolet laser light L, a galvanometer-type beam scanning apparatus 4 to scan the ultraviolet laser light L, and a f lens 5 to collect the ultraviolet laser light L, and its collected light is removed by the the galvanometer-type beam scanning apparatus 4. PCOPYRIGHT: (C)2006,JPO&NCIPI