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HIGHLY RELIABLE SEMICONDUCTOR PACKAGE AND PACKAGING BOARD USING THE SAME
HIGHLY RELIABLE SEMICONDUCTOR PACKAGE AND PACKAGING BOARD USING THE SAME
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机译:高度可靠的半导体封装和使用相同封装的包装板
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摘要
PROBLEM TO BE SOLVED: To prolong a thermal fatigue life of a solder junction.;SOLUTION: Making a round land an irregular shape replaces an occurrence of maximum distortion at a point with an occurrence of maximum distortion in a linear form, and slackens a change in distortion distribution to reduce the maximum distortion. This can prolong the fatigue life.;COPYRIGHT: (C)2006,JPO&NCIPI
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