首页> 外国专利> CLEANING METHOD OF MASK FOR SOLDER PASTE PRINTING, AND SOLDER PASTE PRINTING MACHINE

CLEANING METHOD OF MASK FOR SOLDER PASTE PRINTING, AND SOLDER PASTE PRINTING MACHINE

机译:焊膏印刷用面膜的清洁方法及焊膏印刷机

摘要

PROBLEM TO BE SOLVED: To provide a cleaning method of a mask for solder paste printing which enables efficient cleaning and removal of a residual solder paste after a solder paste is printed by using the mask for solder paste printing, and a solder paste printing machine.;SOLUTION: The mask for printing to which the solder paste after the solder paste printing sticks is cleaned by a cleaning mechanism which is provided for the solder paste printing machine and so constituted that it automatically cleans the mask for printing after the printing without detaching it from the printing machine. On the occasion, the mask is subjected to wet type cleaning with a cleaning solution containing an alcoholic solvent and an ethylene glycol solvent, while at least either blowing or sucking is executed for the mask to which the cleaning solution after the cleaning sticks. The rate of the ethylene glycol solvent in the cleaning solution is made to be 10-90 volume%.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种用于焊膏印刷的掩模的清洁方法,该方法能够在使用该焊膏印刷用掩模印刷焊膏之后,有效地清洁和去除残留的焊膏,并提供一种焊膏印刷机。 ;解决方案:通过专用于焊膏印刷机的清洁机构清洁焊膏印刷后的焊膏的印刷掩模,其构造为在印刷后自动清洁印刷掩模而不将其分离从打印机。在这种情况下,用含有酒精溶剂和乙二醇溶剂的清洗液对面罩进行湿式清洗,同时对附着有清洗液后的清洗液的面罩进行至少吹或吸。使清洁溶液中的乙二醇溶剂的比率为10-90体积%.;版权所有:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP2006168230A

    专利类型

  • 公开/公告日2006-06-29

    原文格式PDF

  • 申请/专利权人 MURATA MFG CO LTD;

    申请/专利号JP20040364965

  • 发明设计人 NAKAKOSHI HIDEO;

    申请日2004-12-16

  • 分类号B41F35/00;B41F15/12;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-21 21:53:55

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