首页> 外国专利> CRYSTALLIZATION METHOD OF SEMICONDUCTOR THIN FILM, SUBSTRATE HAVING CRYSTALLIZED SEMICONDUCTOR THIN FILM, AND CRYSTALLIZATION DEVICE OF SEMICONDUCTOR THIN FILM

CRYSTALLIZATION METHOD OF SEMICONDUCTOR THIN FILM, SUBSTRATE HAVING CRYSTALLIZED SEMICONDUCTOR THIN FILM, AND CRYSTALLIZATION DEVICE OF SEMICONDUCTOR THIN FILM

机译:半导体薄膜的结晶方法,具有结晶半导体薄膜的基板以及半导体薄膜的结晶装置

摘要

PROBLEM TO BE SOLVED: To facilitate the exact arrangement of a recrystallization region (21) formed on an amorphous or polycrystalline semiconductor thin film (12), and to form an alignment mark (15) capable of being utilized in a process for manufacturing an electronic element, e.g. a thin film transistor (98), in the recrystallization region.;SOLUTION: The amorphous or polycrystalline semiconductor thin film (12) is formed on a substrate (11) having a surface composed of an insulating material, an alignment mark (15) is formed at a predetermined position of the amorphous or polycrystalline semiconductor thin film by irradiation with a first laser beam (19), and then a recrystallization region (21) having an enlarged particle size is formed at a predetermined position by irradiation with a second laser beam (20) by alignment based on the alignment mark.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:促进在非晶或多晶半导体薄膜(12)上形成的重结晶区域(21)的精确排列,并形成能够在电子制造过程中使用的对准标记(15)。元素,例如溶液:非晶或多晶半导体薄膜(12)形成在具有绝缘材料表面的基板(11)上,对准标记(15)是通过照射第一激光束(19)在非晶或多晶半导体薄膜的预定位置处形成,然后通过照射第二激光束在预定位置处形成具有增大的粒径的重结晶区域(21)。 (20)通过对准标记进行对准。;版权:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP2006054223A

    专利类型

  • 公开/公告日2006-02-23

    原文格式PDF

  • 申请/专利号JP20040232750

  • 发明设计人 OGAWA HIROYUKI;

    申请日2004-08-09

  • 分类号H01L21/20;H01L21/268;H01L21/336;H01L29/786;

  • 国家 JP

  • 入库时间 2022-08-21 21:53:03

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