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The system and the process which process the plural semiconductor thin film films which are made to crystallize making use of mark cross direction crystallization technology one by one

机译:利用标记横向结晶技术,一对一地处理结晶化的多个半导体薄膜的系统和工序

摘要

A process and system are provided for processing at least one section of each of a plurality of semiconductor film samples. In these process and system, the irradiation beam source is controlled to emit successive irradiation beam pulses at a predetermined repetition rate. Using such emitted beam pulses, at least one section of one of the semiconductor film samples is irradiated using a first sequential lateral solidification (“SLS”) technique and/or a first uniform small grained material (“UGS”) techniques to process the such section(s) of the first sample. Upon the completion of the processing of this section of the first sample, the beam pulses are redirected to impinge at least one section of a second sample of the semiconductor film samples. Then, using the redirected beam pulses, such section(s) of the second sample are irradiated using a second SLS technique and/or a second UGS technique to process the at least one section of the second sample. The first and second techniques can be different from one another or substantially the same.
机译:提供了一种用于处理多个半导体膜样品中的每一个的至少一个部分的方法和系统。在这些过程和系统中,控制照射束源以预定的重复率发射连续的照射束脉冲。使用这种发射的束脉冲,使用第一顺序横向凝固(“ SLS”)技术和/或第一均匀小颗粒材料(“ UGS”)技术辐照半导体膜样品之一的至少一部分。第一个样本的此类部分。在第一样品的该部分的处理完成之后,束脉冲被重定向以撞击半导体膜样品的第二样品的至少一个部分。然后,使用重定向的束脉冲,使用第二SLS技术和/或第二UGS技术辐照第二样本的这样的部分以处理第二样本的至少一个部分。第一技术和第二技术可以彼此不同或基本相同。

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