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ELECTROPLATING METHOD AND ELECTROPLATING DEVICE FOR BOX-SHAPED WORK
ELECTROPLATING METHOD AND ELECTROPLATING DEVICE FOR BOX-SHAPED WORK
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机译:箱形工程的电镀方法和电镀设备
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摘要
PROBLEM TO BE SOLVED: To provide an electroplating method and an electroplating device for a box-shaped work by which, in the case the inside face of a box-shaped work such as a box nut is subjected to surface treatment by dipping the same into a liquid bath, a satisfactory plating film is formed.;SOLUTION: A box-shaped work having a box-shaped space is dipped into a plating liquid of an electroplating bath in such a manner that an opening part thereof turns downward, a suction tube is inserted into the box-shaped space of the box-shaped work from the opening part or the edge part of the suction tube is located in the vicinity of the opening part, and gas present in the box-shaped space and/or fluid as the plating liquid is sucked with the suction tube under negative pressure. By the suction of the gas, the plating liquid progresses into the box-shaped space and is filled therein, and by plating treatment under voltage, a plating film is formed at the inside face of the box-shaped space in the box-shaped work. Alternatively, the plating liquid is discharged with the suction tube so as to form the plating film.;COPYRIGHT: (C)2006,JPO&NCIPI
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