Method of removing electrical continuity of the film structure between blocks are transferred, a method for manufacturing an active matrix substrate, a liquid crystal device and an active matrix substrate

摘要

PROBLEM TO BE SOLVED: To provide an entirely new method for effectively manufacturing a large active matrix substrate or liquid crystal display device having excellent characteristics by executing a new thin film structure transferring technology plural times. SOLUTION: In the case of transferring thin film structure blocks 1000 to 1800 to the surface of transfer bodies by using the thin film structure transferring method, a 1st thin film structure block group (1000, 1200, etc.) is transferred to the surface of a required transfer body at first, and then a 2nd thin film structure block group (1100, 1300, etc.) is transferred so as to be partially superposed to the 1st group and electric conduction between thin film structure blocks is secured on the superposed part. Consequently restriction to the size of a transferring substrate is removed and an active matrix substrate having optional size is manufactured.