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Electrolytic plated modulo the electrolytic plated modulo which features that suffering it makes
Electrolytic plated modulo the electrolytic plated modulo which features that suffering it makes
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机译:电解镀模电解镀模的特征在于它使
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摘要
PROBLEM TO BE SOLVED: To precisely adhere a plating layer uniform in thickness in a prescribed region at the tip of a needle-shaped body by using a gel plating bath. ;SOLUTION: Strach or agarose is added by 0.5-5 wt.% to a well-know plating soln. of palladium, nickel etc., dispersed and heated to obtain a gel plating bath. The former is suitable to heated type electroplating to 50°C and the latter is effective to the electroplating at a room temp. The tip of a rod-or needle- shaped body to be plated is inserted into the gel plating bath where the surface is made ion a mirror shape without being fluidized to male the plaint high in dimensional accuracy possible. Especially, the tip of a semiconductor measuring prove pin consisting of conductive needle single crystal is plated with good controllability in the range of 20-200 μm from the tip by using a contact point material such metals as Pd, Ir, Rh and No, a Pd alloy and an Ag alloy, to obtain a prove card having the probe pin excellent in corrosion resistance and durability without being brought into contact with an electrode or generating a break.;COPYRIGHT: (C)1999,JPO
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