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Electrolytic plated modulo the electrolytic plated modulo which features that suffering it makes

机译:电解镀模电解镀模的特征在于它使

摘要

PROBLEM TO BE SOLVED: To precisely adhere a plating layer uniform in thickness in a prescribed region at the tip of a needle-shaped body by using a gel plating bath. ;SOLUTION: Strach or agarose is added by 0.5-5 wt.% to a well-know plating soln. of palladium, nickel etc., dispersed and heated to obtain a gel plating bath. The former is suitable to heated type electroplating to 50°C and the latter is effective to the electroplating at a room temp. The tip of a rod-or needle- shaped body to be plated is inserted into the gel plating bath where the surface is made ion a mirror shape without being fluidized to male the plaint high in dimensional accuracy possible. Especially, the tip of a semiconductor measuring prove pin consisting of conductive needle single crystal is plated with good controllability in the range of 20-200 μm from the tip by using a contact point material such metals as Pd, Ir, Rh and No, a Pd alloy and an Ag alloy, to obtain a prove card having the probe pin excellent in corrosion resistance and durability without being brought into contact with an electrode or generating a break.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:通过使用凝胶镀浴将厚度均匀的镀层精确地粘附在针状体尖端的指定区域中。 ;解决方案:以0.5-5 wt。%的浓度将Strach或琼脂糖添加到众所周知的电镀液中。将钯,镍等粉末分散并加热以获得凝胶镀浴。前者适用于加热型电镀至50℃,后者适用于室温下的电镀。将待镀的棒状或针状体的尖端插入凝胶镀浴中,在该凝胶镀浴中将表面制成镜面形状,而不会流态化到可能具有较高尺寸精度的原图。尤其是,通过使用诸如Pd,Ir,Rh和No的金属的接触材料,由导电针单晶组成的半导体测量证明针的尖端在距尖端20-200μm的范围内具有良好的可控制性地被电镀。 ,Pd合金和Ag合金制得的证明卡,其探针具有极佳的耐蚀性和耐用性,并且不与电极接触或产生破裂。

著录项

  • 公开/公告号JP3838768B2

    专利类型

  • 公开/公告日2006-10-25

    原文格式PDF

  • 申请/专利权人 電気化学工業株式会社;

    申请/专利号JP19970355203

  • 发明设计人 加藤 和男;中野 辰夫;

    申请日1997-12-24

  • 分类号C25D5/02;C25D3/52;C25D7/00;G01R1/067;G01B7/34;

  • 国家 JP

  • 入库时间 2022-08-21 21:51:43

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