首页> 外国专利> ROUGHENED ROLLING COPPER FOIL FOR HIGH FREQUENCY CIRCUIT AND ITS PRODUCTION PROCESS

ROUGHENED ROLLING COPPER FOIL FOR HIGH FREQUENCY CIRCUIT AND ITS PRODUCTION PROCESS

机译:高频电路的粗轧铜箔及其生产工艺

摘要

PROBLEM TO BE SOLVED: To obtain a rolling copper foil for high frequency circuit which can be used under high frequencies exceeding 1 GHz at a low manufacturing cost.;SOLUTION: A roughened rolling copper foil for high frequency circuit in which the integrated intensity (I(200)) of (200) face determined by X-ray diffraction on the rolled surface of the rolling copper foil after recrystallization annealing and the integrated intensity (Io(200)) of (200) face determined by X-ray diffraction of fine powder copper satisfy a relation I(200)/Io(200)40, arithmetic average of the rolled surface subjected to roughening by electrolytic plating (hereinafter, referred to Ra) is 0.02-0.2 μm and ten-point average (hereinafter, referred to Rz) is 0.1-1.5 μm.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:以较低的制造成本获得可在超过1 GHz的高频下使用的高频电路用轧制铜箔;解决方案:集成强度(I通过再结晶退火后的轧制铜箔的轧制表面上的X射线衍射确定(200)面的(200))和积分强度(I o(200)通过细粉铜的X射线衍射确定的(200)面的>)满足关系I (200) / I o(200)

著录项

  • 公开/公告号JP2006179537A

    专利类型

  • 公开/公告日2006-07-06

    原文格式PDF

  • 申请/专利权人 NIKKO KINZOKU KK;

    申请/专利号JP20040368588

  • 发明设计人 AKASE FUMIAKI;

    申请日2004-12-21

  • 分类号H05K1/09;C25D7/00;C25D7/06;

  • 国家 JP

  • 入库时间 2022-08-21 21:51:37

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号