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ROUGHENED ROLLING COPPER FOIL FOR HIGH FREQUENCY CIRCUIT AND ITS PRODUCTION PROCESS
ROUGHENED ROLLING COPPER FOIL FOR HIGH FREQUENCY CIRCUIT AND ITS PRODUCTION PROCESS
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机译:高频电路的粗轧铜箔及其生产工艺
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摘要
PROBLEM TO BE SOLVED: To obtain a rolling copper foil for high frequency circuit which can be used under high frequencies exceeding 1 GHz at a low manufacturing cost.;SOLUTION: A roughened rolling copper foil for high frequency circuit in which the integrated intensity (I(200)) of (200) face determined by X-ray diffraction on the rolled surface of the rolling copper foil after recrystallization annealing and the integrated intensity (Io(200)) of (200) face determined by X-ray diffraction of fine powder copper satisfy a relation I(200)/Io(200)40, arithmetic average of the rolled surface subjected to roughening by electrolytic plating (hereinafter, referred to Ra) is 0.02-0.2 μm and ten-point average (hereinafter, referred to Rz) is 0.1-1.5 μm.;COPYRIGHT: (C)2006,JPO&NCIPI
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机译:解决的问题:以较低的制造成本获得可在超过1 GHz的高频下使用的高频电路用轧制铜箔;解决方案:集成强度(I通过再结晶退火后的轧制铜箔的轧制表面上的X射线衍射确定(200)面的(200) Sub>)和积分强度(I o(200) Sub>通过细粉铜的X射线衍射确定的(200)面的>)满足关系I (200) Sub> / I o(200) Sub 40,进行电镀处理的粗化后的轧制表面(以下称为Ra)为0.02〜0.2μm,十点平均值(以下称为Rz)为0.1〜1.5μm。COPYRIGHT:(C)2006 ,JPO&NCIPI
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